The new MediaTek Dimensity 6100+ officially debuts a 5G chip for medium-low-end smartphones in the second half of 2023; here are the specifications.
MediaTek has unveiled a new chip for mid-low-end 5G smartphones: the Dimension 6100+. The chip in question aims to ensure good overall performance, proposing a core configuration already adopted on other processors of the Dimensity range with satisfactory results. The new SoC will be available on the market as early as this quarter, but the brands that will adopt it first on their smartphones have not yet been made official.
The Features Of The New MediaTek Dimensity 6100+
Made with the TSMC N6 manufacturing process (at 6 nm), the new MediaTek Dimensity 6100+ chip features an Octa-Core CPU with a 2+6 configuration. There are, in fact, 2 Core Cortex A76 with a maximum frequency of 2.2 GHz and 6 Core Cortex A55, more efficient but less performing, with a maximum frequency of 2 GHz.
These are the same specifications also proposed by the MediaTek Dimensity 700 (made with a 7 nm production process), one of the first “mainstream” 5G chips presented by the company. Even the GPU is the same: it’s a Mali-G57 MC2.
The Dimension 6100+ can manage displays with a maximum resolution of 2520×1080 pixels and a maximum refresh rate of 120 Hz, making it ideal for all budget smartphones that do not want to give up a good quality panel with high resolution and refresh rate values. The chip can be paired with 10-bit displays to reproduce more than a billion colors.
A 5G modem complies with the 3GPP Release 16 standard, integrating MediaTek UltraSave 3.0 technology for connectivity. According to MediaTek, this proprietary technology can reduce consumption related to the use of the 5G network by up to 20% compared to competing solutions. However, no competing chip is mentioned for this comparison.
The peak download speed is 3.3 Gbps. The chip allows you to use Wi-Fi 5 networks and Bluetooth 5.2. Smartphones with MediaTek’s new SoC can communicate with LPDDR4x RAM modules up to 2133 MHz and UFS 2.2 storage.
As for the photographic sector, the chip can manage sensors up to 108 Megapixels and record videos up to 2K at 30 fps. There is also the option to use AI features to make a bokeh effect for portraits and selfies.
The MediaTek Chip Is Ready For Its Debut.
The new MediaTek 6100+, as highlighted by the company, aims to bring the features already available for premium models that use chips from the Dimensity 7000, 8000, and 9000 series to the mainstream, therefore, the medium-low range of the market.
The first smartphones equipped with the new MediaTek chip will be available as early as the third quarter of 2023. The company has not disclosed which OEMs will be the first to bring the new SoC to market. The first smartphones with MediaTek 6100+ could arrive in Italy by the end of the year.